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Topic:  Advanced Materials and Design for Board Level EMI Shielding

 

Meeting Date Wednesday, February 15, 2012  

The Chicago chapter of the IEEE Electromagnetic Compatibility (EMC) Society is proud to announce the February 15 meeting.  The speaker is Colin Tang, of Laird Technologies.  He will be presenting Advanced Materials and Design for Board Level EMI Shielding. 

The continued miniaturization of surface-mounted devices and the increasing density of the printed circuit board (PCB) have made it necessary to shield different zones of a device from each other, to meet the EMC requirement in electronic system. As a low cost and the most common shielding method, a variety of board level can-type shields have been used to eliminate EMI radiation from entering or exiting sections of a PCB. This method has primarily employed solder-attached perforated metal cans to attach and be soldered to the ground trace on a PCB, directly over the electrical components that need to be shielded. The can-type-shields are often installed in a fully automated fashion via a surface mount technology process at the same time the components themselves are installed onto the PCB, using solder paste and a reflow process. Such cans offer very high levels of shielding effectiveness, are typically very reliable, and are widely used in the industry.

Speaker Bio:    Colin Tang

Colin Tong is Senior Materials Scientist at Laird Technologies. He has involved in developing novel EMI shielding materials, and supporting the manufacturing process, with engineering responsibility for EMI shielding products including spring gaskets, electrically conductive polymer matrix composites, knitted wire mesh shields, metal foam and honeycomb waveguides, and board level shields.
 
Before that, he had decade of experience in research and development, testing and characterization, component design and product manufacturing of advanced materials, metallurgical products, thermal management of electronic packaging, as well as electromagnetic interference shields.
 
He holds a Ph.D. and an M.En. in Materials Science and Engineering, and a B. En. in Mechanical Engineering. His research & development activities and industrial practices have resulted in more than 30 papers, several patents, and two books on advanced materials for electromagnetic interference shielding, and thermal management of electronic packaging

 

Dinner Sponsor: Electronic Instrument Associates

 

Time: Social hour and dinner from 6:15-7:00pm. Meeting begins at 7:00pm.  

Date: Wednesday, February 15

Location:  IIT - Rice Lake Campus

201 East Loop Drive

Wheaton, IL 60189

630-682-6000

Cost & Registration: No cost, pre-registration is required.

There is no charge for this event. Please register for attending this meeting.

Registration by phone 847-537-6400 or email: Jack Black jblack@dlsemc.com 

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