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Topic: Advanced Materials and
Design for Board Level EMI Shielding
Meeting
Date Wednesday, February 15, 2012
The
Chicago chapter of the IEEE Electromagnetic Compatibility (EMC) Society is
proud to announce the February 15 meeting. The speaker is Colin Tang, of
Laird Technologies. He will be presenting Advanced Materials and Design
for Board Level EMI Shielding.
The continued
miniaturization of surface-mounted devices and the increasing density of the
printed circuit board (PCB) have made it necessary to shield different zones
of a device from each other, to meet the EMC requirement in electronic
system. As a low cost and the most common shielding method, a variety of
board level can-type shields have been used to eliminate EMI radiation from
entering or exiting sections of a PCB. This method has primarily employed
solder-attached perforated metal cans to attach and be soldered to the
ground trace on a PCB, directly over the electrical components that need to
be shielded. The can-type-shields are often installed in a fully automated
fashion via a surface mount technology process at the same time the
components themselves are installed onto the PCB, using solder paste and a
reflow process. Such cans offer very high levels of shielding effectiveness,
are typically very reliable, and are widely used in the industry.
Speaker
Bio: Colin Tang
Colin Tong
is Senior Materials Scientist at Laird Technologies. He has involved in
developing novel EMI shielding materials, and supporting the manufacturing
process, with engineering responsibility for EMI shielding products
including spring gaskets, electrically conductive polymer matrix composites,
knitted wire mesh shields, metal foam and honeycomb waveguides, and board
level shields.
Before
that, he had decade of experience in research and development, testing and
characterization, component design and product manufacturing of advanced
materials, metallurgical products, thermal management of electronic
packaging, as well as electromagnetic interference shields.
He holds a
Ph.D. and an M.En. in Materials Science and Engineering, and a B. En. in
Mechanical Engineering. His research & development activities and
industrial practices have resulted in more than 30 papers, several patents,
and two books on advanced materials for electromagnetic interference
shielding, and thermal management of electronic packaging
Dinner
Sponsor: Electronic Instrument
Associates
Time: Social
hour and dinner from 6:15-7:00pm. Meeting begins at 7:00pm.
Date:
Wednesday, February 15
Location:
IIT - Rice Lake Campus
201
East Loop Drive
Wheaton,
IL 60189
630-682-6000
Cost
& Registration: No cost, pre-registration is required.
There
is no charge for this event. Please register for attending this meeting.
Registration
by phone 847-537-6400 or email: Jack Black jblack@dlsemc.com
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