Past Meeting Presentations
Past meetings topics included the following: ( If you want more information on these, please contact the appropriate speaker.)
Our October meeting was
Oktoberfest at Elite!
Our speaker was Stewart Forsyth, Lead Technologist from Keysight. Stewart presented IoT and it's latest developments for Wireless technology enabling the IoT. The topic included developments in Bluetooth, Zigbee, NFC, LoRa as well as a description of rapidly emerging cellular with Narrowband IoT Technology.
As usual, we had a feast of food and music sponsored by the good folks from Elite.
meeting was a triple-header at DLS
Starting off with a BBQ at DLS, we had two speakers with great topics!
See the presentation here
Spangler is president and owner of Spangler Prototype, IC, (SPI), a consulting
firm that specializes in power supply design, compliance issues, and pc board layout.
SPI is a member of PSMA. He is a Life Member of IEEE, as well of a number of
societies including PELS, IAS, and PES. He has worked as an FAE for
several semiconductor manufacturers, written industry conference papers,
instructed at the college level, and done design work related to lighting
ballasts and power supplies. His education includes a BEET from DeVry, MSEE from
Northern Illinois, and doctoral work at IIT.
Jim Spangler, Spangler Prototype, presented "Using the PSMA Database. Power Sources Manufacturers Association (PMSA) is a non-profit whose members include manufacturers of power sources and components, academia, and designers/consultants, all related in some manner to creating and using a wide variety of electronic power sources. As part of its mission to serve the industry, PSMA has a database of regulations affecting power sources. This database differs from others in that it is organized as matrix that includes region, country, agency, and product type. Jim will give a live presentation of how the data base functions and how to best use this information in your everyday occupations.
See the presentation here Jim Spangler is president and owner of Spangler Prototype, IC, (SPI), a consulting firm that specializes in power supply design, compliance issues, and pc board layout. SPI is a member of PSMA. He is a Life Member of IEEE, as well of a number of societies including PELS, IAS, and PES. He has worked as an FAE for several semiconductor manufacturers, written industry conference papers, instructed at the college level, and done design work related to lighting ballasts and power supplies. His education includes a BEET from DeVry, MSEE from Northern Illinois, and doctoral work at IIT.
second speaker is our own Jerry Meyerhoff, of JDM Labs.
One of our best attended Chapter meetings,
hosted by Fermi!
Man-Made Noise and the Impact to Radio Communications – The Changing Environment, presented by Ed Hare, W1RFI, IEEE Vice-President of Standards and American Radio Relay League and Greg Lapin, N9GL. Two distinguished experts in the field of Electro Magnetic Compatibility examined the rapidly changing environment of man-made noise and the impact to radio communications. Ed Hare and Greg Lapin are active radio amateurs and members of the American Radio Relay League. They presented ongoing work to characterize the modern environment of man-made radio noise; describe the impact to radio communications; and explain the ongoing work with regulatory agencies to prevent harmful interference to licensed users of the radio frequency spectrum.
Dave Walen, Federal Aviation Administration - Chief Scientific and Technical Advisor for Aircraft gave an excellent program on Electromagnetic Compatibility, as it referenced Portable discussed electronic devices such as smart phones and tablets which integrate high speed computer processors, electronic cameras, satellite-based position services, and radios to support voice and data communications. In late 2013, US airlines allowed passengers to use their tablets, laptops, e-readers and video players during all phases of flight, but require that passengers turn their phones to "airplane mode" during flight. This change seems inconsistent with the earlier restrictions where passengers had to turn off all portable electronic devices during takeoff and landing. Mr. Walen provided the technical backstory for the electromagnetic compatibility issues addressed to allow use of portable electronic devices during flight today. He described the relationship between portable electronic device electromagnetic emissions and potential interference to aircraft avionics, navigation, and radio systems. He will address recent standards that define how aircraft manufacturers and airlines demonstrate tolerance to portable electronic device electromagnetic emissions.
An excellent presentation from Kris Hatashita was enjoyed by all on Military electromagnetic compatibility (EMC). Kris' presentation demonstrated that it is a matter of life and death as modern war-fighters rely on the safe, secure and reliable functioning of their devices. Military EMC includes aspects of electronic interoperability that are seldom or never considered in the commercial realm. This talk presents technical details of EMC consideration in tactical and strategic military operations. The topics discussed include hazards of electromagnetic radiation to ordnance (HERO), electromagnetic data security (EMSEC), counter improvised explosive device (CIED) EMC issues and includes first-hand experiences of work done in the Afghan theatre.
Kris Hatashita has been the Electromagnetic Environmental Effects subject matter expert for the Canadian Army tactical communications group since 2002 where he
Kris has worked at or with many technology corporations throughout his career
Kris’s career in E3 began in 1985 in the aerospace industry after completing
Kris is the past General Chair of the 2016 IEEE International EMC Symposium recently held in Ottawa, Canada
Flynn Lawerence from AR-Worldwide presented Multi-Tone Testing. Traditional Radiated Immunity testing has been performed by sweeping a single tone across a frequency range of interest. Recent technologies have allowed for performing RI testing using multiple tones. Multi-tone testing has many benefits. While the multi-tone methodology was initially implemented to increase the speed of immunity testing, it has been found that this method also improves equipment efficiency, offers greater flexibility to truly test the equipment (EUT) under real world threat conditions, and can be fully compliant to standards. Benefits can also include more efficient use of finite financial and human resources as well as faster time-to-market for new and enhanced products. The presentation is located here at http://www.emcchicago.org/pres/112016.pdf
Nick Buris from NEBENS presented Antenna Technology for MIMO Capable Systems from maximizing Throughput to minimizing Interference. The evolution of Shannon's and Friis' formulas to the case of multi-port Smart Antenna Systems found in WiFi, 4G, 5G and Cognitive Radios. Some typical operations of these systems such as Calibration, Channel Estimation, Beamforming and Space Division Multiple Access, will be outlined. After a brief mention of efforts to modify LOS based antenna design and testing techniques with quantities like Mean Effective Gain (MEG) and Envelope Correlation Coefficient (ECC), the presentation will suggest that Capacity and Throughput be used as the ultimate performance metrics. Applications and examples of antenna systems designed with capacity in mind will be shown. The published, but not yet required, CTIA Test Plan for 2x2 Downlink MIMO and Transmit Diversity Over-the- Air Performance also was discussed as it is the first step toward certifying products at the level of throughput. While this test requires antenna prototypes and functioning transceivers, the talk will include the description of modeling to predict the CTIA test plan performance before a prototype is built. MIMObit, a software simulation tool developed by NEBENS specifically for studies of MIMO capable wireless systems will be described. The presentation is located here at http://www.emcchicago.org/pres/102016.pdf
Mike McNatt from B+B SmartWorx did a great presentation on Networking He demonstrated how to develop this much needed skill. Mike pointed out that networking is a skill that every professional should develop and practice. His talk covered the nuts and bolts of networking, and answers the questions of what, why, when and where, but mainly how. Mike received his B.S.E.E. from Oklahoma State University and M.S.E.E. from University of Missouri at Columbia, and has completed post- graduate courses at IIT. For the past 11 years he has held the position of Compliance Engineer for B+B SmartWorx. Prior to B+B he held test and design engineering positions at Argonne National Labs, Tellabs and BP. Mike has been a facilitator and lecturer at the Naperville Career Transition Workshop for the last 10 years, and has presented talks on Networking, Success on the New Job, and Resume Building. The event was hosted by Elite Electronic Engineering. The presentation is located here at http://www.emcchicago.org/pres/92016.pdf
Mike Caruso presented HEMP and IEMI phenomena, discuss the HEMP and IEMI threat models, explain how they threaten the private sector critical infrastructure facilities and equipment and examine practical and cost effective solutions for achieving comprehensive protection from such threats.
Mike Caruso has over 40 years in the RF shielding industry, now retired from ETS-Lindgren. The presentation is located here at http://www.emcchicago.org/pres/112015.pdf The event was hosted by IIT.
Upal Sengupta presented how wireless power is starting to become more popular with the increased use of small coil technology, utilizing inductive coupling in an intelligent manner. The driving factor for this technology is convenience. Especially for products that are used frequently, and therefore need frequent charging. Wireless power makes the charging process as simple as placing an object on the table. While the technology is just starting to become common, within a few years many public places, offices, vehicles and homes will have charging stations installed so that you won't have to carry your battery chargers with you when traveling or going to work. Wireless power also enables other applications that need waterproof construction (such as medical products, or devices used in the outdoors / harsh environments) to use rechargeable batteries. Upal Sengupta is an Applications Manager with the Texas Instruments Power / Battery Management Solutions Group. Upal joined Texas Instruments in 2004 as an Applications Engineer, has a BSEE from the University of Illinois and an MSEE from Michigan State University. The presentation is located here at http://www.emcchicago.org/pres/ti0415.pdf The event was hosted by DLS Electronic Systems.
Rob Rowe from AR-Worldwide presented Two great presentations, to the chapter and sponsored the event. The event was held at Elite Electronic Engineering in Downers Grove. Rob Rowe presented an update on IEC 61000-4-3 and how that would affect our testing, and reviewed the new DRAFT version IEC61000-4-3, as well as a great explanation of what happens when a power amplifier was driven into compression. Rob also explained new tools and technologies in EMI testing, which included Field Analyzers. A special thanks to Rob for braving the cold to come out to our chapter for this event.
Dennis Lewis from Boeing had a great presentation on the Impact of Cables and Connectors on Radio Frequency and Microwave Measurement Uncertainties. Denis talked about how the most critical part was often assumed or ignored when making measurements. He also talked about connectors from a user point of view. The meeting was held at the IIT Wheaton Campus
This was our kickoff meeting and was held at DLS Electronics Systems. One of own, Roy Leventhal presented "Accounting for Measurement Inaccuracies. The presentation included examples related to passing aircraft EMC regulations for disturbances and IEC 61000 for Immunity. For a copy of the presentation, please contact email@example.com
PDH credits are available here
This meeting was a joint chapter meeting with the IEEE EMC Society Chicago Chapter and the Northwest Sub Section of the IEEE Region 4. Our Angel to the EMC Chapter, Don Sweeney, President, DLS Electronic Systems presented shielding of products from Radiated Emissions. Pitfalls the engineer has to deal with were also covered in-depth. For a copy of this presentation, please contact Don Sweeney at DLS, (847) 537-6400.
PDH credits are available here
This meeting was a joint chapter meeting with the IEEE, SAE, IEEE EMC Society, and the Fox Valley Section IEEE and Billy Martin presented "The Effects of Lightning on Aircraft. Bill Martin, PE, from Cessna-Textron described the basic physics behind the aircraft lightning environment, ie the charge accumulation, leader development, attachment, initial strike, and restrike. Any questions on this presentation, please contact Steve Laya at Elite Electronic Engineering at 630-495-9770.
PDH credits are available here
AR Worldwide presented a new technology in EMI receivers. This tied in with the actual technology internally. The talk discussed 140MHz instantanous bandwidth, 32000 CISPR detectors, or 8,000 MIL-STD PEAK detectors as well as a new direction in EMI testing to reduce times to test EUT's/ This was a well attended event for our chapter! Nick du Toit was our speaker. For questions on this presentation, please call Nic at AR-Worldwide at 215-723-8181.
PDH credits are available here
Tesla PDH credit (not an IEEE EMC Meeting but PDH Credit is available here
Our speaker was Jerry Meyerhoff from JDM Labs. Jerry had a great presentation about "Why does my design FAIL EMC and how to FIX IT!" Jerry introduced 4 quadrants of mechanisms, 3 elements of the actors, and 4 types of coupling. Jerry also discussed case studies from 6 designs. Jerry is Principal EMC Consultant, JDM Labs, LLC and received his BSEE from UIC (University of Illinois at Chicago) with post -graduate studies at IIT. Jerry can be contacted at firstname.lastname@example.org or by phone at 847-630-2769.) PDH credits are available here
On July 11, the Chicago Chapter held a summer social event with the local Chapters of the Microwave Theory and Techniques Society and Antennas and Propagation Society. The event was held at Elite Electronic Engineering in Downers Grove. The meeting topic - “CTIA Standards and Introduction to Antenna Pattern Measurement” – was presented by two highly recognized experts in wireless technology: Paul Moller, Distinguished Member of the Technical Staff at Motorola Mobility and Dr. Michael D. Foegelle, Director of Technology Development at ETS-Lindgren. The technical presentations on wireless standards and antenna technology included a live demonstration of antenna pattern mapping systems used for MIMO and OTA wireless performance evaluations. For details contact email@example.com or by phone 630-924-1600 Related URL is http://ets-lindgren.com/AMS-8050
Our speaker was Kurt Lane from Coilcraft. Kurt demonstrated to us different types of inductor types, the differences in the materials, and discussed filtering in detail. Kurt's presentation discussed the latest generation of tools for the selection, analysis, and use of filter inductors. Any questions on the presentation should be directed to Kurt directly at firstname.lastname@example.org PDH credits are available here
The speaker was Colin Tang, of Laird Technologies and he presented Advanced Materials and Design for Board Level EMI Shielding using a variety of materials. Using different types of materials from solder-attached perforated metal cans soldered to pc boards to materials used in the industry, he compared the performance from each. Colin used EMSCAN in some cases to show the differences in the about of EMI coming from pc boards. Many references from his recent book were covered as well.
April 16, 2011
Bob Hofmann from Hofmann EMC Engineering provided us with an update for C63 as it relates to new specifications. This was a great presentation and if you have an interest in this specification, you missed a great update. Please contact Bob if you want a copy of this presentation.
March 16, 2011
Roger Swanberg, DLS Electronic Systems presented design and layout of low EMI Printed Wiring Boards (PCB) as a low impedance path for your circuit's return current. This path should be on the Ground and Reference planes. Sometimes it isn't.... The talk covered what it takes to produce this Ground or reference plane during the layout of the PCB. Issues covered included holes and splits in these planes and effects of PCB trace layer changes.
February 16, 2011
Roy Leventhal, Leventhal Design & Communications presented EMI-EMC Theory and Troubleshooting at our first EMC meeting of the year. Roy demonstrated this with both simulation and real-world examples. Roy has authored EMI/EMC books and is well respected in the EMC community, and expert in modeling and simulation of Signal Integrity, Power Integrity and EMI-EMC. Full presentation here <click for pdf>
Our Annual combination Oktoberfest and IEEE EMC Society / Fox Valley meeting. The good folks at Elite Electronic Engineering again hosted this event with great food and the theme of Oktoberfest! Music / food and a great meeting by Dr. William Radasky presenting High Power Electromagnetic threats and the Electrical Power System. A copy of the presentation will be posted shortly.
August 25, 2010
Dan Hoolihan, our new Chapter Angel presented to a full room the discussion of Radiated Emissions Measurements at 1/3/5/10/30 meters. He described the two principal types of Emissions Measurements in the world of EMC, conducted and radiated emissions. Dan also discussed and reviewed many technical papers published relative to his presentation that were published for the last 35 years. Full presentation here <click for pdf>
April 21, 2010
Tom Millineaux from Milmega presented two presentations to the chapter.
Demystifying Radio Frequency Fields and Radio Frequency Components and
Aiding the 17025 Laboratory Accreditation Process by Capturing Key Performance Data on RF Power Amplifiers. The first presentation looked at situation the great 18th and 19th century masters faced along the uncharted road from static electricity to the prediction and discovery of RF fields. The story picked up with Benjamin Franklin’s contribution to static electricity and then described the ‘great race’ that followed the accidental discovery that an electric current deflects a compass needle. The talk is rounded off with an explanation of the working of common RF components. The second presentation was on RF immunity standards do not require periodic calibration of the RF amplifiers used in RF immunity testing. This is justified from a strictly technical point of view, yet creates the situation where there is no data on file for the most expensive piece of equipment in the test set-up. This presentation goes through the key amplifier performance metrics, and introduces a simple / swift method of capturing key data that can be held on file as ‘trend-analysis’ data.
March 9, 2010
Dr. Maradei, new IEEE EMC society President discussed the current status and the new direction of the future of the EMC Society. Additionally, Dr. Maradei discussed modeling of power distribution networks in printed circuit boards
February 16, 2010
Tom Revesz from HV Technologies presented updates to IEC Conducted Immunity Standards Edition 2 updates, 2004-2009, IEC61000 -4-2, -4, -5, -11 Standards Revisions and their implications to the practicing engineer. Tom Revesz is the EMC Sales Manager at HV TECHNOLOGIES, Inc. based in Manassas, VA. He is responsible for North American sales, service, and support of the EMC-PARTNER & Montena emc brands of conducted and radiated pulsed transient immunity test equipment applicable to a broad range of worldwide commercial, industrial, military, and avionics test standards. Tom has an extensive technical sales and marketing background in the EMC Industry, having been affiliated with different manufacturers of transient test equipment as well as an EMC Test Lab. Tom holds a BSEET from Cal Poly Pomona and MSB from Johns Hopkins University. Presentations are too large to email or download - contact Frank Krozel for a copy
This meeting was a joint meeting with Women in Engineering as well as our own EMC Society. Sharon Phillips presented "How EMC Benefits Society". Sharon Phillips is the present Secretary of the IEEE Chicago Section Executive Committee. She is a Sr. Member of the IEEE and a member of the Communications Society, the EMC Society, and IEEE-Women In Engineering. Ms. Phillips is an RF engineer with a long service history at Motorola where she first worked in Motorola’s Chicago Corporate Research & Development organization on development of test systems in the areas of single-sideband in the land-mobile environment, spectral efficiency for 2nd generation cellular, and data transmission in the ISM band indoor environment. Her work impacted NAMPS, TDMA, GSM, and IEEE802.11 standards development.
This was a joint meeting with the Society of Automotive Engineers (SAE) and IEEE Electromagnetic Compatibility (EMC) Society, as well as the Annual Oktoberfest at Elite Electronic Engineering. The meeting topic has been selected to overlap the interests of both societies. The keynote presentation, “Current Commercial Telematics Technology”, explored the concepts, benefits, technology and innovation behind real-time monitoring of commercial vehicles and assets through advanced electronics, GPS systems, and wireless communications. The speaker was Emad Isaac, Chief Technology Officer for the Morey Corporation of Woodridge Illinois. As an added interest, members of the Fox Valley Electric Auto Association had an electric vehicles at this event. As with past joint events, this meeting has an “Oktoberfest” theme and includes dinner, refreshments, and music. The dinner and background polka music made for an enjoyable social event and provided a great opportunity for members of each society to cross-network.
Green Power & The Modern Grid
Jerry Ramie, ARC Technical Resources, Inc.
The existing power grid is aging, overloaded, unstable and incapable of meeting the power quality needs of an Information Economy. This fast-moving overview of the modern grid, and renewable energy's place in it, details the problems of the existing grid and the features of a modern grid architecture that can address these shortcomings. The various: "roadmaps," proposed to achieve this vision are presented.
The Federal Government's recently proposed economic stimulus package contains about $60 Billion for smart grid and green power investments in the next two years. With this much consensus for moving forward, the various choices in media to support the Advanced Metering Initiative are discussed, along with their relative strengths and weaknesses.
Two major threats to the energy infrastructure are openly presented, physical and cyber security. The third major threat that is just emerging is the "reliability" threat of improper EMC methods and testing in substations and generation plant. This threat and its remedies will also be explored. Remaining challenges will be identified and conclusions drawn.
Jerry is a 26 year veteran of the EMC, communications and power industries and has authored six books on substation EMC for the Electric Power Research Institute. (EPRI) He has published articles on grid modernization and sits on the EMC Committee of the American Radio Relay League, (ARRL) on the Board of Directors of the Santa Clara Valley EMC Society, is a voting member of the IEEE-P1775 committee on EMC in BPL installations, a member of the IEEE Standards Association, an iNARTE-certified EMC technician, Secretary of the ANSI Accredited Standards Committee C63R on EMC and a Senior Member of the IEEE. He can be reached at email@example.com
Mr. Chaman Bhardwaj has earned his BSEE degree at Punjab Engineering College, Chandigarh, India. He has studied additional post-graduate courses in USA, in semiconductor device physics, fiber optics and RF microwave circuit design.
he is a Senior Engineer, in Global Compliance department at Shure
Incorporated. He has also served as an EMI/EMC engineer at R&B
Enterprises, Megahertz Corporation, US Robotics, 3COM, Member
Staff EMC Applications Engineer at Texas Instruments, and Senior
EMI/EMC/Quality Engineer at Motorola. He has worked as a
consultant and contractor for defense organizations, to name a few
Hamilton Sundstrand, Honeywell, Bosch Security Systems, Inc., and
Sanmina-SCI. He is a NARTE certified EMC Engineer.
The presentation covered What are worldwide safety standards for ITE and Audio Video products? What are principles of safety? What are Energy Efficiency and Environmental regulations? What are EMI and EMC regulations? What are EMC directives? What are Interferences sources, what are RF Immunity criteria? Immunity requirement standards, the design process, Software considerations, component placements, design for reduced emissions, common mode and differential mode signals, Cables, shielding, enclosures, aperture size, pre-compliance, Pre-compliance tools. A copy of his presentation is located here <click>
The competition for interesting and well paying engineering jobs is now worldwide and is intense. The pressure to outsource routine work is also intense. EMI-EMC engineering is anything but routine, particularly if you like problem solving and stay at the top of your game. EMI-EMC engineering offers just such opportunities and the chance to make a real contribution to good product design. EMI-EMC engineering is and will remain in high demand and on the cutting edge of new product development.
Our presenter, Roy Leventhal presented examples of typical technical and organizational
challenges in this field in passing regulatory requirements. Plus, how these challenges are met with a combination of theoretical, laboratory, and computer skills.
The talk explained how signal integrity (SI), power integrity (PI), and EMI-EMC performances affect each other and how computer-aided analysis facilitates better designs. In SI, reflections are a possible source of radiated and conducted emissions. In PI, power - power return voltage bounce are a high probability source of radiated and conducted emissions. SI, PI and EMI interact with each other through conduction and coupling mechanisms. Coupling and coupling mechanisms usually look the same whether emitting or picking up EMI so a design that doesn't perform well on emissions usually doesn't perform well on susceptibility.
Mr. Roy Leventhal is Co-Owner of Leventhal Design & Communications. He has many years of experience in electronics design and related fields. He specializes in modeling and simulation, including signal integrity, EMI, RF circuit design, SPICE, S-Parameter, IBIS, semiconductor modeling, device physics, quality, component reliability, and failure analysis. Roy is principle author of the book Semiconductor Modeling: For Simulating Signal, Power and Electromagnetic Integrity, Roy Leventhal and Lynne Green, Springer 2006, ISBN: 978-0-387-24159-3.
Roy earned his MSEE at Illinois Institute of Technology. He performed additional post-graduate studies in semiconductor device physics and in RF microwave circuit design.
During his career, Roy has worked as an RF designer in military electronics, a semiconductor applications engineer (Fairchild and National Semiconductor), a component engineer (GE Medical), a Reliability and Failure Analysis Engineer (Tektronix), a Signal Integrity Engineer (Cadence Design Systems and 3Com), and is currently an EMI-EMC Engineer at Hamilton-Sundstrand on the Boeing 787 program.
Additionally, Roy has had hands-on experience using the following simulators: PSPICE, SABER®, MAST®, Allegro/SPECCTRAQuest®, CST Microwave Studio®, Omega PLUS®, and FLOEMC®.
Roy has served as the IBIS Committee web page Librarian for IBIS model sources and participated in the IBIS subcommittee for model quality. He has taught signal integrity at Cadence Design Systems and 3Com Corporation and has been guest speaker at several IEEE EMC Society meetings. In 2002, Roy was recognized by 3Com management for reducing the high-speed digital design process from multiple prototype cycles to one single cycle.
November 19, 2008. This meeting featured Dr. Stephan Frei, Professor of Electrical Engineering at the Technische Universitat Dortmand in Dortmand, Germany. He discussed methods to improve the reproducibility of ESD tests. ESD reproducibility is a vexing problem for EMC engineers and circuit designers. Dr. Frei draws on his research and experience in ESD phenomena in this presentation. He leads a research group dealing with on-board automotive systems. His work involves model-generation and simulation of cable harnesses, automotive bus systems, automotive electronics, and the effects of ESD on these. He is an IEEE EMC Society Distinguished Lecturer.
This special "Oktoberfest” was hosted by our friends at
Elite, where they offered attendees a special dinner buffet,
food & drinks. This presentation covered the general
function, construction, and composition of EMI filters. Our
speakers discussed the various topologies, ie single stage filters,
T, L, pi, single and dual stage filters. The information
included an explanation of filter attenuation, capacitor impedance
vs. frequency curves, inductor (ferrite) impedance vs. frequency
curves as well as test item impedance considerations. Attendees
learned how to select a filter based on parameters such as topology,
attenuation, packaging, etc. We had two highly regarded
technical presenters for this meeting.
James Price, VP of Engineering for Corry Micronics, Wexford Pennsylvania , and Bob Meilleur, Engineering Manager for Corry Micronics, Corry , Pennsylvania .
September 29, 2008
Daryl Gerke, PE/NCE, is a partner with Kimmel Gerke Associates, Ltd., an engineering consulting and training firm that specializes in EMI/EMC issues. Daryl has a BSEE from the University of Nebraska, and is a Registered Professional Engineer (PE) and a NARTE Certified EMC Engineer. Daryl has been professionally involved with EMC since 1970, and has been a full time EMC consulting engineer since 1987. He is a Senior Member of the IEEE, and is active in his home EMCS chapter in Phoenix, AZ.
February 21, 2007
David Hockanson, Ph.D. is a Senior Staff Engineer with the EMC Design group of Sun Microsystems, Inc. He discussed the world of EMC/EMI debug and how it has long been shrouded by a consideration that there must be some "black magic" associated with eliminating system compliance issues. Using physics and signal analysis, logically developed solutions can be determined to facilitate EMC/EMI containment and/or mitigation. This talk facilitated a discussion on the tools, methods, and process of solving radiated emissions issues arising during testing.
A Discussion on Double Negative Materials, Transition Boundary Conditions, Controllable Surfaces, and Design of a New Class of Metamaterials was presented by Christopher Holloway, National Institute of Standards and Technology (NIST) Electromagnetics, Division U.S. Department of Commerce, Boulder Laboratories. Chris discussed metamaterials theory and applications. He also showed that the effective permeability and permittivity of composite medium consisting of insulating magneto-dielectric spherical particles embedded in a background can be simultaneously negative for wavelengths where the spherical inclusions are resonant to form a DNG material. The theoretical results presented showed that composite media having much simpler structure than those recently reported in the literature can exhibit negative permeability and permittivity over significant bandwidths. Click here for Chris' presentation Additional information can also be found here.. http://www.interferencetechnology.com/emcnews/id1145
Semiconductor Modeling for High-Speed Digital Circuits: Roy Leventhal described (from his new book) the following:
A large percentage of simulation models used for high-speed digital networks are SPICE transistor level physical models. However, SPICE models can be a computation burden. IBIS models are also used for component level simulation and offer the advantage of speed and simplicity, but they are not meeting current needs for modeling complex I/O buffers. To expand the capabilities of the IBIS models, experts in the field of computational electromagnetics are r elying on macromodeling, AMS modeling and additions aimed at Power Integrity analysis. IBIS models are being structured with more analysis capacity so that I/Os with adaptable, adjustable drive levels and other refinements can be simulated without including excessive detail. The paper will present a step-by-step review of how various levels of simplification (abstraction) are applied to transistor level physical models resulting in behavioral models, macromodels, and equation-based models. Participants will see how to achieve the best speed versus accuracy trade-off of simplicity versus detail that is balanced to their needs. The session concludes with a brief introduction to Cadence Design Systems, Inc., macromodeling templates. Roy Leventhal is an independent trainer and contractor with 45 years of engineering experience specializing in EDA modeling and simulation for signal integrity, power integrity, and EMI. Roy has a background in RF circuit design, IBIS, SPICE and Scattering-Parameter semiconductor modeling, device physics, component reliability, and failure analysis. He earned his BSEE/MSEE at Illinois Institute of Technology. More recently, Roy took additional post-graduate courses at the University of Wisconsin – Milwaukee, concentrating on RF and microwave subjects.
Mr. Hofmann presented information on ANSI C63.5 which is the standard for determination of free-space antenna factors and the calibration methods for antennas used in EMC testing. His presentation covered the various calibration methods, i.e. Standard Site Method, Reference Antenna Method, and Equivalent Capacitance Substitution Method. He also provided information on the most the recent document revision and the significance of the updates to EMC testing. Bob Hofmann is a member of several ANSI C63 subcommittees and led the 1987 and 1999 revisions of ANSI/IEEE C63.12 on Electromagnetic Compatibility Limits. He worked on the 1991, 1992, 2001, and 2003 revisions of C63 .4 on Methods of Measurement of Emissions. Bob is a past President and a Life Member of the IEEE EMC Society and a Senior Member of the IEEE. Bob retired from Bell Laboratories/Lucent Technologies after 44 years of service. He represented Bell Labs as chairman of the Information Technologies Industries Council (ITI) TC-5 EMC Committee from 1990 to 1999. He is a NARTE registered engineer. He has a BSEE degree from the University of Florida and an MSEE degree from New York University.
Gary Fenical, Laird Technologies presented the Advancements in RF Shielding Materials. Gary discussed the higher mechanical reliability requirements, as well as cost cutting pressures that are driving electronics packaging engineers to find new and innovative EMC shielding solutions. This presentation covered key advancements in shielding technology available today and related developments on the horizon. Just about every class of shielding product has seen noteworthy changes. Foam-based products, such as Ultra-Soft Sculpted Fabric-Over-Foam offer a high degree of compression set performance with increased shielding over the life of the gasket. Conductive foams have been developed for low compression load deflection (CLD), lower closure force, while delivering X, Y, and Z axis conductivity for improved high-frequency shielding. This makes conductive foam an ideal EMI shielding material in vertical compression and low cross-shear applications . Conventional shielding and RF gasketing materials no longer meet the performance requirements of today’s electronics. Miniaturization and ever increasing frequencies have contributed to the need for change. Electrically conductive elastomers which can be produced in extremely small profiles can be deposited onto small substrates; they are fast becoming the answer to the miniaturization dilemma. The need to reduce costs but not performance, while at the same time increasing geometric complexity, has led to the development of much more versatile and higher performance EMI products. Metal-Mold in Place (MIP) and Rotary Form in Place (FIP) provide small intricate gaskets, unique geometries, minimal footprint, and excellent shielding. Frameless vent panels greatly improve cooling capability with no reduction in shielding while providing a more robust cost effective solution.
This presentation was on the latest update to the European EMC Directive. A comprehensive look at the recent changes to the directive, the date for implementation, how it will effect test methodology, test reporting, testing procedures, and testing laboratories, as well as the requirements for existing products already on the market.
The presenter was Donald L. Sweeney, Senior EMC Engineer and President and founder of D.L.S. Electronic Systems, Inc, an independent compliance testing and consulting company. He is a graduate of the Department of Electrical Engineering, University of Illinois at Champaign Urbana, and has over 40 years experience in the EMC and electrical engineering fields. Mr. Sweeney specializes in EMC, RFI, and EMI consulting and testing. He has taught EMC at the University of Wisconsin, and at Oakton College. Mr. Sweeney has served as a special consultant to Lawrence Livermore National Laboratory, and the Nuclear Regulatory Commission. Mr. Sweeney is a member of IEEE EMC Society, currently on the IEEE EMC Society Board of Directors, and is past Chapter Chairman for the Chicago chapter of the IEEE EMC Society. Mr. Sweeney is the founding chairman of the U. S. Council of Independent Laboratories. For additional details, please contact the speaker, Donald L. Sweeney of DLS at 847-537-6400.
The Presentation "EMC Testing of Substation Products" concerns the EMC testing requirements for products that are installed in Generation or Substation plants here in the US or in Europe. The Generic EMC Standards for Substations (CIGRE 36.04, NEMA ICS-1 and IEC 61000-6-5) are discussed and their similarities are pointed out in detail. A fuller view of the testing requirements for Protective Relaying equipment is presented, and a run-down of the required tests is given. The future growth potential of utility products is very bright and these tests will be run more often than in the past. Many manufacturers will need to become acquainted with these Standards to access this growing market. Their products will be evaluated using these types of tests and the reliability of the finished Utility installation will be affected by how well their products perform on these tests. Anyone that needs to install control products into Substation settings will be tasked with accrediting products to these Standards eventually. Additional questions, please contact Jerry Ramie, ARC Technical Resources.
Emissions Measurements Using Grid Array of Near Field Probes..
Emscan technology applies a grid array of small H-field probes embedded in
an 8 layer circuit board covered by a protective surface upon which the PCB
to be tested is placed. The array of antennae and electronic switching
achieve high-speed measurement of the current flows on populated printed
circuit boards. The user can visualize real time emission hot spots in either a spectral or
spatial format and utilize the information to identify problem areas and
possible solutions. This presentation will include a demonstration of the
technology. Speaker: Doug McKinnon, EMSCAN Corporation http://emscan.com/
Update on Ferrite Technology
This presentation reviewed and discussed the most recent advances in Ferrite component technology. Areas addressed included ferrite component use and installation techniques, as well as effects of temperature on permeability and frequency response. Also reviewed were advances in materials technology as changes in manufacturing methodology and material morphology provide enhanced product performance. The presenter was John Horner of the Fair-Rite Corporation. John is a member in good standing with the IEEE EMC Society, and is a past presenter at the IEEE International Symposium on Electromagnetic Compatibility as well as a presenter at the IEEE EMC Society Chicago Chapter Mini Symposium on EMC. John currently holds the position of Sales Manager of Fair-Rite Products and has over 21 years experience in the field of EMC
Calibration of RF Field Probes from 10kHz-40GHz
RF field probes play a vital role in EMC test laboratories where RF immunity testing and measurements of electric field strength are performed. This meeting will feature a discussion on methods for calibrating, use, and performance of RF Field probes. The presenter did an overview of the IEEE 1309 specification and provided a description of the various types of probes including: single & multi-axis monopoles, orthogonal dipoles, single dipole antenna probes, and laser/crystal elements. The various calibration methods will be reviewed, such as TEM Cell, strip line, Tri-plate, GTEM, discrete antennas, open-ended waveguides, standard gain horn antennas, mode-stirred chambers, and OATS vs. anechoic site. The presenter also described probe calibration parameters such as frequency response, linearity, channel match, and isotropic response. Finally, the discussion covered parameters affecting calibrations, probe usage in the lab, and finally measurement uncertainty. Jack Andrews has worked for many years as an EMC engineer and is currently employed by Liberty Labs.
An Approach to Board Level Suppression
This talk covered the setup and operation of a low cost suppression site. It showed an approach to setting up and using a site for identifying and suppressing EMI signals from small electronic devices or systems. These emissions can be identified by means of a systematic, organized approach down to the device and pin level where suppression techniques can then be applied.
Roger Swanberg is a NARTE Certified and EMC Engineer Senior EMC Engineer working at D.L.S. Electronic Systems, Inc. He is a Graduate of the Illinois Institute of Technology in Chicago and has held various positions in the Electronic Engineering field for over 40 years. As EMC and Electronics Design Engineer, Roger worked for Motorola Consumer Products and Zenith Radio in Color TV design, Nuvatec Design Consulting as EMC designer and Manager of EMI Testing Services, US Robotics as Regulatory Compliance and Engineering Support Manager, Motorola Lighting and Motorola Cellular as EMC and Electronics Designer. He is presently Vice-Chair for the IEEE EMC Society and Secretary for the IEEE 2005 Symposium in Chicago. For additional information on this presentation, contact Roger at 847-537-6400.
Conducted Immunity Transient Testing for CE Marking
This seminar provided a background knowledge of the IEC and EN standards used for EMC conducted transient immunity testing for CE marking of electrical and electronic products. The phenomena behind the transients plus verification techniques for the transient pulses was discussed. Special emphasis was given to the requirements for EN 60601-1-2, the Medical Electrical Equipment EMC requirements and tests as related to conducted immunity. Pending changes to the conducted immunity requirements for medical equipment are outlined so that the EMC engineer can be prepared to implement these new requirements in a timely manner. Thomas C. Moyer graduated from Drexel University in Philadelphia with a BSEE degree. He has worked for Ford Motor Company designing automotive electronics systems and for Ametek U. S. Gauge designing aircraft engine instruments. More recently, he has been a sales engineer and regional sales manager. He joined Amplifier Research in 1996 as a product line
marketing specialist. For additional information, Tom can be reached at 215-723-8181.
October 14, 2003
event was a joint meeting of the Chicago Chapters of the IEEE EMC
Society, Society of Automotive Engineers (SAE), and the Institute of
Environmental Science and Technology (IEST).
Norman Traub , Director of Electrical Initiatives , SAE International discussed 42 Volt DC Systems. This presentation outlined efforts by the automotive community to provide a degree of standardization to the process and defined some of the technical challenges facing implementation in production vehicles including the impact of 42V on electrical arcing of contacts. Norman L. Traub is the SAE Director of Electrical Initiatives, including the 42V Initiative. Traub has lectured extensively on 42V electrical systems, including the SAE World Congress, International Power Electronics Conference, International Society of Automotive Transportation and Technology. He is a member of the MIT/Industry Consortium on Advanced Automotive Electrical/Electronic Components and Systems (50 multi-national companies). He is also the chairman of the SAE 42V Advisory Committee. Traub received his MSEE from Michigan State University.
February 11, 2003
Mike Windler, Underwriters Laboratories discussed the summary of recent efforts conducted under the auspices of the American National Standards Institute (ANSI) Accredited Standards Committee C63, Sub-Committee 1, working group 1-13.2. The main purpose of this group is to assess the applicability of low-frequency site qualification methodologies, prescribed in current domestic and international standards (e.g. CISPR, ANSI) to frequencies above 1 GHz. A new measurement procedure, which uses presently available equipment and should fully evaluate all types of facilities, has been derived. Conceptually, this procedure is a rotational pattern comparison of an antenna in a reference site to the same antenna in a test site . Michael J. Windler is an Associate Manager responsible for the operation of the EMC laboratory of Underwriters Laboratories Inc. in Northbrook IL where he has worked since 1985. Any questions, call Mike at 847-664-3409
Our "First Holiday" Party was held at "Dave & Busters". Attended by over 50 people, this seems like it will continue in the future! Several people went home with gift certificates certainly welcomed at this time of year. See you next year!
Mike Howard of Liberty Labs discussed the calibration of a dipole antenna used on an upcoming satellite mission to the planet Mars, called Mars Express. The dipole was placed on this satellite and operates from 1.5 to 5.5Mhz. The dipole is pulsed and will be used to detect water beneath the perma frost of the surface of Mars. The Mars Express will be launched atop a Russian Soyuz rocket next June.
October 15, 2002
PCB for EMC was presented by one of our own, Roger Swanberg, of DLS. Roger talked about the fundamentals of designing for EMC when doing printed wiring cards. In addition, how to do the design right the first time. For details on this presentation, please call Roger at DLS, at 847-537-6400.
September 18, 2002
This was the kickoff meeting for the chapter! Chapter President Ray Klouda had various different speakers discussing the IEEE EMC International Symposium in Minneapolis, and trends that are in the industry. In addition, plaques were delivered to Jack Black (2001) and Frank Krozel (2000) for "Person of the Year! (Congrats Jack) and Frank Krozel. Tom Braxton discussed 2005 at Navy Pier, and that is moving along very well! Roy Leventhal discussed EMI Simulation Sources and went into great detail on resources available to all. The meeting closed with a great CD of Don White discussing war stories of EMC as related to the Society in Washington DC. Jack Black ended the meeting with his own war stories of Montreal. This venue seemed to appeal to all there.
April 17, 2002
Jim Muccioli, a NARTE certified EMC and ESD engineer from Jastech EMC Consulting , X2Y, discussed broadband capacitor performance through Inductance Cancellation... The presentation included an overview of X2Y capacitor technology which utilizes unique internal layered circuit architecture. The device is applied for RF shielding, decoupling, noise suppression, transient voltage suppressions and is designed to reduce the number of standard capacitors, inductors, ferrites, and other passive elements used in a circuit.
March 26, 2002
Dwayne Davis, Associated Research, Inc.,Technical Services Manager, discussed applications and analysis covered by EN 50191. In addition he covered what methods can be employed to meet this new standard. EN 50191 covers virtually every aspect of setting up a safe work station. He is a recognized expert in the field of electrical safety testing and its application.
Jerry Meyerhoff, (847-480-5886) Principal Staff Engineer, Motorola Automotive, explained the application of computer modeling, simulation, and EMC analysis techniques to better understand the EMC behavior of electronic systems. He presented his experiences in EMC troubleshooting and demonstrated the useful and practical application of computer modeling and simulation techniques. The discussion drew from examples of automotive electronics, however the techniques have wide applicability to electronics in all industries.
Dave Hurd, LeCroy Corp (630-258-2301), covered the measurements of interest for designers of switchmode power conversion circuits and devices. With the goal of high efficient and reliable designs, he presented the acquisition of voltage and current, their relationship in switchmode power conversion circuits, and the analysis of power devices to perform accurate analysis while the power transistor or diode is operating in the non-ground referenced primary circuit of an off-line switchmode power supply. Instrumentation requirements such as overdrive recovery, high frequency common mode rejection, and channel-to-channel time delay matching were covered. A unique technique was covered for using information contained in the pulse width modulation signal to find a power circuit’s step response and soft start performance.
Werner Schaefer, Cisco Systems, Inc. Presented an exciting seminar on Receivers, and interpretation of signals, IF detectors, and dynamic range. This also includes a discussion of specifications like dynamic range IF bandwidth specifications which are not called out in the standard.
Kurt B. Fischer, Hyper Corporation discussed the Bluetooth Wireless Technology including what is Bluetooth Wireless Technology, how to qualify a Bluetooth component, radio module, or end product (process overview), how to test to the RF test specification, what is the Bluetooth qualification test facility application and approval process, validation of test instruments and test systems --- why is validation important? Kurt included a complete process that the Bluetooth manuacturers need to go through to get the product to market. Copies of Kurt's presentation are available my e-mailing Frank Krozel.
Mike Windler, Associate Managing Engineer, EMC Lab, Underwriters Labs (847-272-8800) discussed the techniques for EMC measurements used with antennas above 1
GHz have been gleaned from methods used at lower frequencies. The
assumptions made in applying these techniques have not been completely
validated. This analysis will compare antennas for use above 1 GHz, showing
ramifications from use of each type. Measurement methods used above 1 GHz
as well as the effects of antenna parameters such as antenna pattern,
beamwidth and polarization will be reviewed. Several commonly available
antennas will be measured and their results studied. Frequencies from 1 to
18 GHz were considered.
February 21, 2001
Horror stories in Automating EMC Testing was presented by Mike Hart, President, Quantum Change Systems. A frank discussion of the pitfalls found when automating EMC measurements. Discussion includes idiosyncracies of different manufacturers. Issues of BIOS's. Detecting errors in both commands and implementation. What to do when nothing works. Verifying your results - and what happens when your verification does not work either. One good thing about all these problems - Job Security for the EMC engineer. Mike Hart has been President of Quantum Change since it's inception, and previously was President of EMCO Antennas.
Ray Klouda, Sr. EMC Engineer, and Steve Laya, Sales and Marketing Manager, Elite Electronic Engineering, Inc. (630-495-9770) presented the Correlation of Radiated Emissions Data in a Reverberation Chamber at Elite Engineering in Downers Grove, Illinois.
This presentation described the correlation effort that’s underway at Elite as a part of the Automotive EMC Lab Recognition Program (AEMCLRP). Radiated emissions data was presented for Elite’s new reverberation chamber and for the reference chamber at GM’s Milford Proving Grounds. The data analysis and correlation effort presented offered a practical application for the chamber theory presented at the IEEE-EMC chapter meeting last December at Lindgren RF Enclosures. This presentation also provided an overview of the new Automotive EMC Lab Recognition Program that has been developed by Ford, GM, and DaimlerChrysler.
January 17, 2001
H. R.(Bob) Hofmann, (630-979-6237) Distinguished Member of Technical Staff, Bell Laboratories, Naperville, discussed the introduction on the topic of measurement uncertainty in radiated and conducted emission measurements. It used simple mathematics to show how the various components used in making measurements add to the total measurement uncertainty of the final results. Bob Hofmann has been with Bell Labs for 43 years, working on EMC issues for the past 22 years. He is the head of the Lucent/Bell Labs Corporate EMC Committee. He represents Lucent on ANSI accredited EMC Committee C63 and various C63 subcommittees, and is the Lucent representative to and vice-chair of ECMA EMC committee TC-20. He was the lead editor of ANSI C63.12-1999 and contributing editor to ANSI C63.4-1991, 1992, and 2000.
Joe Weibler, ETS-Lindgren, ( 630-307-7200) Engineering Manager, presented an introduction to reverberation chamber technology, introduced the concepts, concerns and proper use of chambers to those new to the technology. An outline of the current status of standards and recent developmental efforts for reverberation chamber technology also was presented to bring users, and potential users, up to date. A demonstration of reverberation chamber technology was presented in the on-site chamber at the Lindgren facility."
Jerry Meyerhoff, Motorola Automotive, (847-480-5686), Principal Staff Engineer, discussed "Unexpected resonance effects in vehicle applications.' A case study for radiated RF immunity of electronics installed in an over-the-road truck. Measured whole vehicle anechoic chamber lab data was compared to wireframe models simulated with NEC, the Numeric Electromagnetic Code .
Dr. Clifford Kraft, Lucent Technologies, (630-979-3280) discussed the effects of a small metal reflector as the reflector moved about the Fresnel ellipse of an Open Area Test Site.
The effect and the modeling technique used to determine it was presented.
September 20, 2000
Mr. Tom Moyer, Electrical Sales Engineer (215-723-8181), Amplifier Research Product manager for EM Test, Inc. This presentation reviewed a common and reproducible basis for evaluating the performance of electrical and electronic products when subjected to repetitive Electrical Fast Transients or classically known as ... EFT.
April 26, 2000
Mark Montrose, Principal Consultant of Montrose Compliance Services, Inc., Senior member IEEE, current member of the Board of Directors for the IEEE EMC Society, and Distinguished Lecturer for the society.
This presentation illustrated, in simple form, how and why EMI gets developed within a printed circuit board (PCB) and the manner in which propagation occurs; radiated and conducted. Basic concepts are examined to remove the mystery on why problems are designed into the product, and how one can prevent making mistakes from happening time and time again.
March 29, 2000
The Medical Directive - An Update...was presented by Pat Malloy (215-723-8181), Senior Sales Applications Engineer, Amplifier Research. This presentation dealt with Medical Device Directive 93/42/EEC with an emphasis on EMC compliance. Both the current version as well as the proposed 2nd edition were covered. Amplifier Research manufactures power amplifiers from D.C. to 40GHz, EMC Immunity antennas, ARCell, and a variety of accessories. In addition, Amplifier Research has a strategic alignment with EM Test, for Conducted Immunity test equipment.
February 23, 2000
Donald L. Sweeney, President, D.L.S. Electronic Systems, Inc (847-537-6400). presented how a manufacturer can use a CAB to gain access to the European market. The steps that are needed to comply with the rules. It will also include the latest news from some of the committees and what is on the horizon as far as the European Union is concerned. This was a pizza meeting and all enjoyed the camaraderie, compliments of DLS.
January 26, 2000
Kevin Baldwin, EMC Test Systems (203-838-4555) presented the Cassper "Virtual Chamber", and source localization system. This is a very hot topic for people in need of "minimizing" ambient signals. The actual system will be demonstrated on February 29, 2000 at the Holiday Inn in Itasca. ETS, under the umbrella of ESCO, offers the EMC community RF Shielded Enclosures, Rantec Anechoic Material and chambers, and EMCO EMC products.
Roy Leventhal works at 3Com (847-797-2152) in Mt. Prospect as a Sr. Signal Integrity Engineer. He earned his BSEE & MSEE at Illinois Institute of Technology, the latter in 1966. More recently he was in the PhD EE program at the University of Wisconsin - Milwaukee before that was interrupted by career moves. His main area of study was RF and microwave. Roy had in interesting discussion on Signal Integrity.
3Com manufacturers the famous Palmtop hand helds, modems for laptop and desktop computers, camera systems for internet operation.
October 27, 1999
Bob Hofmann of Lucent (630-979-3627) discussed the round robin of tests on a radiator that will be shipped around the country, and the results tabulated and compared. This should provide the EMC community with some interesting information on OATS, Chambers and receiver performance reference repeatability. FYI, Bob's results were resolved down to the hundredth of a DBuV! In addition, Bob updated us on the FCC's intent of dropping Part 15 and adopting CISPR 22 for Conducted Emissions.
Dr. Clifford Kraft of Lucent (630-979-3280) discussed RF coupling into cables, and the different methodologies that need to be addressed when attempting to resolve the interference. Many different guidelines were discussed, like if impedance is low, use inductors - if the impedance is high, use capacitors.
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